New ADT Resin Wafer Dicing Blade 00777-H053-010-QIP 58 x 0.254 x 40mm #270 53mic - JIMFRA
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New ADT Resin Wafer Dicing Blade 00777-H053-010-QIP 58 x 0.254 x 40mm #270 53mic

New ADT Resin Wafer Dicing Blade 00777-H053-010-QIP 58 x 0.254 x 40mm #270 53mic

USD 10.00 USD
SKU: vD0wx9GQ
Condition: New

Specifications

All Returns AcceptedReturnsNotAccepted
BrandADT
Equipment/Component TypeBlade
Model00777-1003-004-QIP
MPN00777-1003-004-QIP

New ADT Resin Wafer Dicing Blade 00777-H053-010-QIP 58 x 0.254 x 40mm #270 53mic. Condition is "New". Shipped with USPS First Class.

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