Epoxy Potting Compound 4 Large & Thick Pours -Low Exotherm Thermally Conductive
Specifications
| All Returns Accepted | ReturnsNotAccepted |
| Expiration Date | Does Not Expire |
| MPN | MAXEPC40 |
| Brand | MAX EPOXY RESIN SYSTEMS |
| Country/Region Of Manufacture | United States |
For Encapsulating Electronic Parts And Circuit Boards Watch the video demonstration above for potting and embeding electrical circuitry. Prepare the circuit board to be potted.The circuit board should be clean and solder flux is removed to ensure a good bond.Use spray flux remover to clean the printed circuit board before embedding in the MAX EPC A/B. Allow the solvent flux remover to dry thoroughly before potting.Pre arrange the wire leads to the desired position and secure.Premix the contents of the MAX EPC Part A to redisperse any settling of the dense filler.In a clean mixing container, weigh the PART A and Part B at a 4:1 mix ratio.Mix gently to minimize air entrapment until the components are well blended to a uniform consistency. Pay close attention to the bottom and edges of the mix containerPoor and inadequate mixing will cause uncured or tacky spots to appear.Pour the mixture into another clean container and mix for another minute. This will ensure a thoroughly mixed resin is achieved and ensure a full cure.Pour the mixed MAX EPC into the component housing to be encapsulated ensuring complete and level coverage.Dispense from one corner of the component casing and allow the material to completely flow and fill the casing and encapsulate the circuit. View the video demonstration link below. This technique will reduce voids and air entrapment. IMPORTANT NOTICEYour purchase constitutes the acceptance of this disclaimer. Please review before purchasing this product.The user should thoroughly test any proposed use of this product and independently conclude the satisfactory performance in the application. Likewise, if the manner in which this product is used requires government approval or clearance, the user must obtain said approval.The information contained herein is based on data believed to be accurate at the time of publication. Data and parameters cited have been obtained through published information, PolymerProducts and Polymer Composites Inc. laboratories using materials under controlled conditions. Data of this type should not be used for a specification for fabrication and design. It is the user's responsibility to determine this Composites fitness for use.There is no warranty of merchantability for fitness of use, nor any other express implied warranty. The user's exclusive remedy and the manufacturer's liability are limited to refund of the purchase price or replacement of the product within the agreed warranty period. PolymerProducts and its direct representative will not be liable for incidental or consequential damages of any kind. Determination of the suitability of any kind of information or product for the use contemplated by the user, the manner of that use and whether there is any infringement of patents is the sole liability of the user.